发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes a semiconductor substrate containing silicon, a p-type semiconductor active region formed on the semiconductor substrate, a first gate insulating film containing at least one of Zr and Hf and formed on the p-type semiconductor active region, a first gate electrode formed on the first gate insulating film and formed of first silicide containing silicon and a first metal material and having a work function level lower than the central position of a band gap of the p-type semiconductor active region, and a first source region and first drain region configured by a second silicide containing silicon and the first metal material and formed to sandwich the p-type semiconductor active region.
申请公布号 US2005167766(A1) 申请公布日期 2005.08.04
申请号 US20040874211 申请日期 2004.06.24
申请人 YAGISHITA ATSUSHI 发明人 YAGISHITA ATSUSHI
分类号 H01L21/28;H01L21/336;H01L21/8234;H01L21/8238;H01L21/84;H01L27/092;H01L27/12;H01L29/417;H01L29/423;H01L29/49;H01L29/51;H01L29/78;H01L29/786;(IPC1-7):H01L29/76 主分类号 H01L21/28
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