| 摘要 |
PURPOSE:To protect a printed wiring board against static troubles by printing antistatic ink on an upper both upper and lower surfaces to form an antistatic coat. CONSTITUTION:A circuit pattern 2 is formed of copper foil, etc., on an insulating board 1. The circuit pattern 2 includes a land 3 for attaching equipment. A solder resist 4 is applied through silk screen printing, etc., over an area of the circuit pattern 2 which need not be soldered. Furthermore, an overcoat for protection is applied. Antistatic coats 5, 6 are applied to an upper or both upper and lower surfaces of an almost completed printed wiring board. The antistatic coat, which is not a conductor unlike a conductive ink used for a jumper line, etc., is not a complete insulator; therefore, a coat 5 prevents development of troubles in electrical characteristics with some distance 7 from the land 3.
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