发明名称 DOUBLE-SIDED FLEXIBLE BOARD PROVIDED WITH HEAT CONDUCTIVE DESIGN
摘要 PROBLEM TO BE SOLVED: To provide a double-sided flexible board provided with heat conductive design, for conducting the quantity of heat generated by an attached electron device through a wiring layer and a heat conductive through-hole to a heat radiation layer and preventing the overheating and burning of the electron device. SOLUTION: The double-sided flexible board provided with the heat conductive design includes a substrate 14, the wiring layer 12 and the heat radiation layer 18 provided on both surfaces of the substrate, and the heat conductive through-hole 16 for conducting the wiring layer and the heat radiation layer. A connection pad 12a which can be electrically connected to the electron device 10 is provided in the wiring layer. The electron device can be the driver IC of a liquid crystal display. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009076634(A) 申请公布日期 2009.04.09
申请号 JP20070243735 申请日期 2007.09.20
申请人 KINSUS INTERCONNECT TECHNOLOGY CORP 发明人 KYO BUNHITSU;YO TOKUSHO
分类号 H01L23/36;H01L23/12 主分类号 H01L23/36
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