ADHESIVE AGENT FOR CONNECTING ELECTRODE AND CONNECTING METHOD USING THE ADHESIVE AGENT

摘要

Insulating adhesives or adhesive films which ensure both of sufficient repairability and continuity reliability and connection methods with the use of the same are provided. By using an insulating adhesive 10 comprising a component curing in the low temperature side having a radical polymerization thermosetting mechanism and a component curing in the high temperature side having an epoxy thermosetting mechanism, IC chips 30 are primarily compression bonded (tentative compression bonding) to a wiring board 20 at the 80% reaction temperature of the component curing in the low temperature side. Subsequently, the IC chips 30 are secondarily compression bonded (final compression bonding) to the wiring board 20 at the 80% reaction temperature of the component curing in the high temperature side.