LASER REMOVAL OF CONDUCTIVE SEED LAYERS

摘要

Various techniques are disclosed for an apparatus and a method to remove a layer from a substrate having a pattern formed on the layer. In one example, the apparatus comprises a stage configured to receive and hold the substrate. The apparatus may further comprise an irradiating device comprising a projection lens and configured to irradiate the surface of the substrate with pulses of laser light having a selected fluence to remove an interstitial portion of the layer between the pattern without removing the pattern for corresponding irradiated areas of the substrate. The pulses of laser light may be focused through the projection lens, and the stage and the projection lens may be configured to move continuously relative each other to irradiate a plurality of areas of the substrate with the pulses of laser light.

主权项

1. An apparatus comprising:
a stage configured to receive and hold a substrate comprising a surface with a pattern formed on a layer; and an irradiating device comprising a projection lens and configured to irradiate the surface of the substrate with pulses of laser light having a selected fluence to remove an interstitial portion of the layer between the pattern without removing the pattern for corresponding irradiated areas of the substrate, wherein the pulses of laser light are focused through the projection lens, and wherein the stage and the projection lens are configured to move continuously relative each other to irradiate a plurality of areas of the substrate with the pulses of laser light.