| 摘要 |
Provided is a radiation-sensitive resin composition that contains a binder resin (A), a radiation-sensitive composition (B), an epoxy cross-linking agent (C) having an epoxy equivalent weight of no greater than 450, a softening point of no greater than 30°C, and no greater than four functional groups, and an aralkyl phenol resin (D). The present invention can provide a radiation-sensitive resin composition able to provide a resin membrane having high adhesion to metal layers and that is superior with respect to developability and low hygroscopic properties. |
