電気的に絶縁されるプリントヘッドダイ接地ネットワークをフレキシブル回路で電気的に接続する方法

摘要

PROBLEM TO BE SOLVED: To provide a method of electrically connecting printhead die ground networks as a flexible circuit, the method solving the problem that printhead die fabrication processes involving etching of a silicon substrate are not optimally performed in a case where the silicon substrate and a device layer are grounded.SOLUTION: A printhead assembly 100 for an inkjet-printing device comprises: a printhead die 104; and a flexible circuit 106 connected to the printhead die. The printhead die includes a substrate 202, a first ground network 206 electrically connected to the substrate, a device layer, and a second ground network 212 electrically connected to the device layer. The first ground network and the second ground network are electrically isolated from one another within the printhead die. The first ground network and the second ground network are electrically connected to one another at the flexible circuit.