Seal Ring Structure With A Metal Pad

摘要

A method includes providing a substrate having a seal ring region and a circuit region, forming a seal ring structure over the seal ring region, forming a first frontside passivation layer above the seal ring structure, etching a frontside aperture in the first frontside passivation layer adjacent to an exterior portion of the seal ring structure, forming a frontside metal pad in the frontside aperture to couple the frontside metal pad to the exterior portion of the seal ring structure, forming a first backside passivation layer below the seal ring structure, etching a backside aperture in the first backside passivation layer adjacent to the exterior portion of the seal ring structure, and forming a backside metal pad in the backside aperture to couple the backside metal pad to the exterior portion of the seal ring structure. Semiconductor devices fabricated by such a method are also provided.

主权项

1. A method comprising:
forming a seal ring structure over a first side of a semiconductor substrate; forming a first passivation layer over the first side of the semiconductor substrate; forming a first metal pad over the first passivation layer on the first side of the semiconductor substrate, wherein the metal pad includes a recess; forming a second passivation layer directly on the metal pad and within the recess; and forming a second metal pad over a second side of the semiconductor substrate that is opposite the first side of the semiconductor substrate.