| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE HAVING PHOSPHOR LAYER AND METHOD OF FABRICATING THE SAME |
| 摘要 |
Provided are light emitting device package having a phosphor layer and a method of fabricating the same. A package substrate having a wiring pattern is disposed. A light emitting device mounted on the package substrate is disposed. The light emitting device has a main body having a light emitting layer therein. The light emitting device has an upper electrode on an upper surface of the main body. A bonding wire is connected to the upper electrode and the wiring pattern. A phosphor layer is formed on the light emitting device. The phosphor layer has a recessed space to accommodate the upper electrode and the bonding wire. The phosphor layer covers a side surface of the light emitting device. |
| 申请公布号 |
US2015249193(A1) |
申请公布日期 |
2015.09.03 |
| 申请号 |
US201414548255 |
申请日期 |
2014.11.19 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HONG Sung-Yong;KIM Kyung Tae;PARK Hyung-Jin;PARK Hee-Seok;WANG Ji-Seok |
| 分类号 |
H01L33/50;H01L33/36;H01L33/48 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package comprising:
a package substrate having a wiring pattern; a light emitting device mounted on the package substrate, and having a main body having a light emitting layer therein, and an upper electrode on an upper surface of the main body; a bonding wire connected to the upper electrode and the wiring pattern; and a phosphor layer formed on the light emitting device, wherein the phosphor layer has a recessed space to accommodate the upper electrode and the bonding wire, and the phosphor layer covers a side surface of the light emitting device. |
| 地址 |
Suwon-si KR |
