| 发明名称 |
FINGERPRINT MODULE AND MANUFACTURING METHOD FOR SAME |
| 摘要 |
A fingerprint module of fingerprint identification chip is provided. The fingerprint module includes a substrate, a fingerprint identification chip, a molding layer, a color layer, and a protecting layer. The substrate includes a pair of surfaces and a plurality of pads. The surfaces are on the opposite sides of the substrate. The pads are exposed on one of the surfaces. The fingerprint identification chip electrically connects with the substrate according to at least a wire. The molding layer disposes on the substrate and covers the fingerprint identification chip and the wire. The color layer disposes on the molding layer. The protecting layer disposes on the color layer. |
| 申请公布号 |
US2015243571(A1) |
申请公布日期 |
2015.08.27 |
| 申请号 |
US201414279279 |
申请日期 |
2014.05.15 |
| 申请人 |
DYNACARD CO., LTD. ;EGIS TECHNOLOGY INC. |
发明人 |
TSAI PAI CHING;HWANG NIAN-HORNG |
| 分类号 |
H01L23/04;G06K9/00;H01L21/52;H01L23/31;H01L21/56 |
主分类号 |
H01L23/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A fingerprint module comprising:
a substrate comprising a pair of surfaces and a plurality of pads, the surfaces formed on two sides of the substrate, the pads exposed on one of the surfaces; a fingerprint identification chip electrically connected with the substrate by at least a wire; a molding layer disposed on the substrate and covering the fingerprint identification chip and the wire; a color layer disposed on the molding layer; and a protecting layer disposed on the color layer. |
| 地址 |
TAOYUAN COUNTY TW |
