| 摘要 |
<p>The present invention relates to a fixing jig for testing a memory package with a harsh condition composition structure. The purpose of the present invention is to test a thermal limitation feature of the memory package. For this, the present invention includes an upper jig which includes a package receiving unit which receives the memory package, a lower jig which fixes a socket board, a pusher housing, a lifting panel which is installed on the lower side of the pusher housing to be elastically lifted, a pressing panel which is installed on the lower side of the pusher housing and lifts the lifting panel, a lifting unit, a pusher block which includes a pusher which presses the memory package, a thermal environment harsh unit, a cooling unit, a lifting lever, and a finishing cover.</p> |
