A SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

摘要

Disclosed is a semiconductor package. The semiconductor package includes: a first package substrate; a first semiconductor chip disposed on the first package substrate; a second package substrate which is provided on the first semiconductor chip, includes a chip region overlapped with the first semiconductor chip and a connection region adjacent to the chip region, and has a first surface having a recess part facing the first semiconductor chip and a second surface having a protrusion part facing the recess part on the chip region; and a second semiconductor chip arranged on the second package substrate. The second package substrate is provided with the same thickness in the chip region and the connection region.