发明名称 |
SUBSTRATE PROCESSING DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an induction heating type substrate processing device which is excellent in processing gas contact property and uniformly heats a substrate.SOLUTION: A processing container 2 includes: a susceptor 4 in which a substrate mounting part 6 is formed on a side face; a gas supply part 16; an exhaust part; an induction heating element 40 that is disposed at an inner peripheral side of the processing container 2 and at an outer peripheral side of the susceptor 4 so as to surround a region of the susceptor 2 where the substrate mounting part is formed; and an induction heating coil 42 disposed at an outer peripheral side of the processing container 2. The processing container 2 further includes: a first heat insulation member 52 formed over at least the formation region of the susceptor 4 in a height direction at the inner peripheral side of the processing container 2 and at an outer peripheral side of the induction heating element 40 so as to surround the induction heating element 40; a second heat insulation member 54 disposed within the processing container and at an upper side of the susceptor 4; and a third heat insulation member 56 disposed within the processing container and at a lower side of the susceptor.</p> |
申请公布号 |
JP2015153983(A) |
申请公布日期 |
2015.08.24 |
申请号 |
JP20140028349 |
申请日期 |
2014.02.18 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
NAKAO MASARU;NAKAJIMA MAKOTO |
分类号 |
H01L21/205;C23C16/458;C23C16/46 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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