发明名称 SUBSTRATE PROCESSING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide an induction heating type substrate processing device which is excellent in processing gas contact property and uniformly heats a substrate.SOLUTION: A processing container 2 includes: a susceptor 4 in which a substrate mounting part 6 is formed on a side face; a gas supply part 16; an exhaust part; an induction heating element 40 that is disposed at an inner peripheral side of the processing container 2 and at an outer peripheral side of the susceptor 4 so as to surround a region of the susceptor 2 where the substrate mounting part is formed; and an induction heating coil 42 disposed at an outer peripheral side of the processing container 2. The processing container 2 further includes: a first heat insulation member 52 formed over at least the formation region of the susceptor 4 in a height direction at the inner peripheral side of the processing container 2 and at an outer peripheral side of the induction heating element 40 so as to surround the induction heating element 40; a second heat insulation member 54 disposed within the processing container and at an upper side of the susceptor 4; and a third heat insulation member 56 disposed within the processing container and at a lower side of the susceptor.</p>
申请公布号 JP2015153983(A) 申请公布日期 2015.08.24
申请号 JP20140028349 申请日期 2014.02.18
申请人 TOKYO ELECTRON LTD 发明人 NAKAO MASARU;NAKAJIMA MAKOTO
分类号 H01L21/205;C23C16/458;C23C16/46 主分类号 H01L21/205
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