CONDITIONER HAVING DOT PORTION FOR POLISHING CMP PAD AND METHOD OF MANUFATURING THEREOF

摘要

The present invention relates to a CMP pad conditioner having a dot portion and a method of manufacturing the same. Particularly, The CMP pad conditioner includes a substrate having at least one flat surface, at least one dot portion formed on the flat surface, and polishing particles formed on the surface of the dot portion. The dot portion has a protruding spherical surface with a preset curvature (R). Therefore, high surface profile is maintained while the polishing amount of the pad per time is reduced.