| 发明名称 |
LED PACKAGE |
| 摘要 |
According to a first aspect there is provided a light emitting diode (LED) package. The LED package comprises a heat spreader having a first side and a second side, the first side having a planar surface and the second side being asymmetrical relative to the first side. One or more LED die are mounted on a surface of the second side of the heat spreader. In particular, the surface of the second side of the heat spreader can be shaped or angled relative to the planar surface the surface of the first side. |
| 申请公布号 |
US2015236232(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201314426525 |
申请日期 |
2013.09.06 |
| 申请人 |
LITECOOL LIMITED |
发明人 |
Reeves James;Young Andrew;Wakefield Elwyn |
| 分类号 |
H01L33/64;H01L33/54;H01L25/075 |
主分类号 |
H01L33/64 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode LED package for attachment to a heat sink transfer assembly comprising:
a heat spreader having a first side and a second side, the first side having a planar surface and the second side being asymmetrical relative to the first side; and one or more LED die mounted on a surface of the second side of the heat spreader. |
| 地址 |
Sheffield, South Yorkshire GB |
