| 摘要 |
A substrate fixing apparatus comprising: a back-up member which is located between a pair of conveying members arranged at a distance from each other in a plan view from above and is below a film-like substrate conveyed along the conveyance path and supported from below by the pair of conveying members; and an elevation driver which moves at least one of the back-up member and the substrate pressing member upward and downward, wherein the elevation driver elevates the back-up member and/or lowers the substrate pressing member together with the pair of conveying members, thereby separating the substrate upward from the pair of conveying members while supporting the substrate from below by the back-up member and pressing the surface of the outer peripheral part of the substrate downward by the substrate pressing member to correct warpage of the outer peripheral part of the substrate. |
