| 发明名称 |
Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package |
| 摘要 |
A method for manufacturing a chip package is provided. The method includes forming a layer over a carrier; forming further carrier material over the layer; selectively removing one or more portions of the further carrier material thereby releasing one or more portions of the layer from the further carrier material; and adhering a chip including one or more contact pads to the carrier via the layer. |
| 申请公布号 |
US9111847(B2) |
申请公布日期 |
2015.08.18 |
| 申请号 |
US201213523942 |
申请日期 |
2012.06.15 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Meyer-Berg Georg |
| 分类号 |
H01L21/00;H01L23/00;H01L21/56;H01L23/31 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a chip package, the method comprising
forming a layer over a carrier; forming further carrier material over the layer; selectively removing one or more portions of the further carrier material thereby releasing one or more portions of the layer from the further carrier material; and adhering a chip comprising one or more contact pads to the carrier via the layer; wherein forming a layer over a carrier and forming further carrier material over the layer comprises adhering a foil comprising the layer and further carrier material to the carrier. |
| 地址 |
Neubiberg DE |
