| 摘要 |
<p>The present invention relates to a method for manufacturing a circuit board using the dissolution of metal nanoparticles and a circuit board manufactured therethrough, and more specifically, to the method for manufacturing a circuit board using dissolution of metal nanoparticles and the circuit board manufactured therethrough which is configured to realize an environment friendly process without environmental contamination, and at the same time, easily form fine patterns on a substrate. The present invention has a purpose to provide the method for manufacturing a circuit board using dissolution of metal nanoparticles and a circuit board manufactured therethrough which can provide an environment friendly substrate manufacturing process by resolving problems of environment pollution which is currently highlighted in the manufacturing of circuit boards, forms metal wiring without resistance through the removal of molecular binder, and at the same time, easily forms a wiring of fine patterns through surface tension control technology.</p> |
