| 摘要 |
The purpose of the present invention is to provide a laminated polishing pad that can be flatly bonded to a polishing platen even if it is large in size. This laminated polishing pad, comprising a polishing layer and a support layer with an adhesive member interposed therebetween, wherein the polishing layer contains 0.5 to 5% by weight of a hydrophilic substance; the support layer is a layer obtained by integrally molding a cushion layer and a resin film having a thermal dimensional change rate of 1.3 to 12.6%; the laminated polishing pad has a concavely warped form in the polishing layer side; and the laminated polishing pad has an average warp amount of 3 to 50 mm at the peripheral edge of the pad. |
