| 发明名称 | Power module package and method of manufacturing the same | ||
| 摘要 | Disclosed herein are a power module package and a method of manufacturing the same. The power module package includes first and second semiconductor devices mounted on sides of first and second lead frames, ends of which are separated from each other, respectively, a support pin corresponding to a mounting position of the first semiconductor device and formed adjacent to a lower portion of the first lead frame, and a molding portion formed to cover portions of the first and second lead frames and the first and second semiconductor devices. | ||
| 申请公布号 | US9099451(B2) | 申请公布日期 | 2015.08.04 |
| 申请号 | US201414275565 | 申请日期 | 2014.05.12 |
| 申请人 | Samsung Electro-Mechanics Co., Ltd. | 发明人 | Ha Job |
| 分类号 | H01L23/495;H01L21/50;H01L21/48;H01L23/373 | 主分类号 | H01L23/495 |
| 代理机构 | Ladas & Parry, LLP | 代理人 | Ladas & Parry, LLP |
| 主权项 | 1. A power module package comprising: first and second semiconductor devices mounted on sides of first and second lead frames, ends of which are separated from each other, respectively; a support pin corresponding to a mounting position of the first semiconductor device and formed adjacent to a lower portion of the first lead frame; and a molding portion formed to cover portions of the first and second lead frames and the first and second semiconductor devices. | ||
| 地址 | Gyeonggi-Do KR | ||