| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can ensure a width of a bottom of a trench and keep a shape of the trench successfully.SOLUTION: A semiconductor device 100 comprises: a first laminated structure ST1 composed of at least one first insulation film 81 provided above a surface of a substrate 10 and a plurality of first conductive films 90, 91; a connection part 50 provided in the first laminated structure and electrically connecting the plurality of first conductive films 90,91; a second laminated structure ST2 composed of a plurality of second insulation films 82 and a plurality of second conductive films 92 which are provided on the first laminated structure; and a semiconductor column 40 which pierces the second laminated structure ST2 to reach the first laminated structure ST1 and insulated from the first and second laminated structures.</p> |
