发明名称 |
METHOD OF CUTTING HIGH-HARDNESS MATERIAL WITH MULTI-WIRE SAW |
摘要 |
In a method of cutting a high-hardness material with a multi-wire saw, an ingot of the high-hardness material is sliced into a plurality of wafers by cutting the ingot at multiple points simultaneously with the multi-wire saw. The method comprises repeating a run cycle of reciprocating motion of a wire of the multi-wire saw so that the relationships (1) c1≧20, given C1=b/a and (2) 0.35≦c2≦1.55, given c2=d/a are satisfied, where a is a maximum total contact length defined as a sum of the lengths of the ingot as projected onto multiple cut points when projecting the ingot onto the wire in a direction in which the ingot is going to be cut, b is a continuous travel distance of the wire, and d is a length of the wire newly fed in each said run cycle. |
申请公布号 |
US2015202700(A1) |
申请公布日期 |
2015.07.23 |
申请号 |
US201514596453 |
申请日期 |
2015.01.14 |
申请人 |
Hitachi Metals, Ltd. |
发明人 |
KONDO Sadahiko;MIYACHI Akira |
分类号 |
B23D61/18;B28D1/08 |
主分类号 |
B23D61/18 |
代理机构 |
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代理人 |
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主权项 |
1. A method of cutting a high-hardness material with a multi-wire saw, in which an ingot of the high-hardness material is sliced into a plurality of wafers by cutting the ingot at multiple points simultaneously with the multi-wire saw,
wherein the method comprises repeating a run cycle of reciprocating motion of a wire of the multi-wire saw so that following relationships are satisfied:
c1≧20, given C1=b/a, where a is a maximum total contact length defined as a sum of the lengths of the ingot as projected onto multiple cut points when projecting the ingot onto the wire in a direction in which the ingot is going to be cut, and b is a continuous travel distance of the wire; and
0.35≦c2≦1.55, given c2=d/a, where d is a length of the wire newly fed in each said run cycle. |
地址 |
Tokyo JP |