PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要
<p>The present invention relates to a printed circuit board and a method of manufacturing the same. According to an embodiment of the present invention, the printed circuit board comprises: an insulating layer which includes a through-via hole; a through-via which is formed in the through-via hole and includes a seed layer and a plating layer formed in the seed layer; and a circuit layer which is formed in at least one of an upper part or a lower part of the insulating layer and includes the seed layer and the plating layer.</p>
