RESIN DOUBLE LAYER COATED COPPER, MULTI-LAYERED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention provides a resin double layer-attached copper foil, a multilayer printed circuit board including the resin double layer-attached copper foil, and a manufacturing method thereof, where the copper foil comprises: (a) a copper foil having a predetermined surface roughness formed on one side thereof; (b) a first insulation resin layer formed on a rough surface of the copper foil; and (c) a non-fiber substrate type second insulation resin layer formed on one side of the first insulation resin layer which contains an inorganic filler and a resin. The present invention provides a buildup printed circuit board capable of implementing a high-density microcircuit pattern by reducing an entire stacking thickness, and lowering an interlayer coefficient of thermal expansion for a substrate.