| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a curable resin composition showing excellent heat resistance, adhesiveness and thermal conductivity in a cured product, and to provide an adhesive for heat radiation comprising the curable resin composition.SOLUTION: The curable resin composition comprises a tetrafunctional epoxy resin having a 1,1'-binaphthalene-2,2',7,7'-tetraol skeleton, and a heat-conductive filler; and the composition is excellent in thermal conductivity. The composition further has excellent heat resistance, adhesiveness and thermal conductivity and is useful as a heat-conductive adhesive. A cured product obtained from the composition can be suitably used as a heat-radiation member.</p> |
