MEMBER PEELING METHOD, MEMBER PROCESSING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

摘要

To enable quick peeling using a reliable technique when mutually peeling a first and second member mutually joined via a first adhesive layer. The member peeling method includes a step for preparing a first member 10 having a first main face 10a and an outer edge 10b thereof and a second member 12 having a second main face 12a and an outer edge 12b thereon, a step for disposing a photothermal conversion layer 14 on at least one portion of the outer edge 10b on the first main face 10a, a step for mutually joining the first main face 10a and the second main face 12a via an adhesive layer 16, a step for irradiating a laser light L to the photothermal conversion layer 14, and a step for at least partially peeling the first member 10 from the second member 12 by applying a force to an outer peripheral portion 10c and 12c of either member of the first member 10 or the second member 20 in a direction away from the other member of the first member 10 or the second member 1.