Provided is an LED lighting device including a housing which is combined to the back side of a substrate having an LED mounted on the front side and has an internal receiving space; a thermal conduction medium which is inserted into the receiving space of the housing and is made of a porous material; a phase change material (PCM) which fills the receiving space of the housing; and a heat sink combined to the housing. Therefore, the present invention can prevent a hot-spot phenomenon of locally increasing temperature by transmitting uniform heat. The lifespan and efficiency of an LED chip can be improved.
