REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD

摘要

Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.

主权项

1. A thermal compression bonding process bond head comprising:
a heater; a cooling block configured to conduct heat from the heater; and a thermal expansion coefficient compensating structure coupled to a portion of the cooling block and configured to couple the cooling block to the heater such that there is no direct interface between the cooling block and the heater.