| 发明名称 |
SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALLELISM RELATED TO BONDING OF SEMICONDUCTOR ELEMENTS |
| 摘要 |
A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation. |
| 申请公布号 |
US2015155254(A1) |
申请公布日期 |
2015.06.04 |
| 申请号 |
US201414553782 |
申请日期 |
2014.11.25 |
| 申请人 |
Kulicke and Soffa Industries, Inc. |
发明人 |
Schmidt-Lange Michael P.;Wasserman Matthew B.;Braun Christopher W. |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonding machine for bonding semiconductor elements, the bonding machine comprising:
a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation. |
| 地址 |
Fort Washington PA US |
