| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus for processing glass substrates which reliably eradicates the influence of warpage of the outer circumferential part of a glass substrate, particularly a glass substrate of tempered glass in which the outer circumferential part is liable to warp, avoids distortion of the internal part of the glass substrate, and thus can be subjected to high quality scribing along a planned cleaving line. <P>SOLUTION: A planar table comprising porous members is used as a substrate holding table 10 on which a glass substrate 1 is placed, and the grain size of the porous member of the outer circumferential part 15 of the substrate holding table 10, supporting a part corresponding to the outer circumferential part of the glass substrate 1 to be placed on the porous planar table is made different from the grain size of the porous member of the internal part 16 supporting a part corresponding to the internal part of the glass substrate 1, thereby making adsorption force strong in the outer circumferential part of the porous planar table and weak in the internal part. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
