发明名称 |
RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD |
摘要 |
A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin (A), a cyanate ester compound (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises at least a surface-treated silicon carbide (C-1) of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide. |
申请公布号 |
EP2860219(A1) |
申请公布日期 |
2015.04.15 |
申请号 |
EP20130804513 |
申请日期 |
2013.06.06 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
KOBAYASHI, HIROAKI;SOGAME, MASANOBU;NOMIZU, KENTARO;MABUCHI, YOSHINORI;KATO, YOSHIHIRO |
分类号 |
C08L63/00;B32B5/02;B32B15/08;B32B15/14;B32B15/20;C08G59/40;C08J5/24;C08K3/14;C08K9/02;H05K1/03;H05K1/05 |
主分类号 |
C08L63/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|