| 发明名称 | Method of manufacturing printed circuit board and printed circuit board | ||
| 摘要 | A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles α1 and α2 between the polishing direction of the exposed portion of the copper layer and the bending lines C1 and C2 satisfy the following formula (1): 30°≦α1 and α2≦150° (1). | ||
| 申请公布号 | US9006579(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201213617366 | 申请日期 | 2012.09.14 |
| 申请人 | Fujikura Ltd. | 发明人 | Inaba Masatoshi;Miyata Hiroshi;Watanabe Hirohito |
| 分类号 | B32B38/10;H05K1/00;H05K3/24;H05K3/26;H05K1/11 | 主分类号 | B32B38/10 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A method of manufacturing a printed circuit board which is to be bent about a bending line, the method comprising: forming a conductor layer of an interconnection pattern on an insulating layer; laminating a covering layer on the insulating layer so as to expose a part of the conductor layer from the covering layer and cover the conductor layer by the covering layer; mechanically polishing at least the exposed portion of the conductor layer; and performing a plating process on the exposed portion of the conductor layer so as to form a plated layer on the conductor layer, wherein an angle (α) between the polishing direction of the exposed portion of the conductor layer and the bending line satisfies the following formula (1): 30°≦α≦150° (1). | ||
| 地址 | Tokyo JP | ||