| 摘要 |
<p>PROBLEM TO BE SOLVED: To process a bonding substrate in the vacuum while suppressing the impact of bubbles.SOLUTION: A vacuum processing apparatus 100 for processing a bonding substrate S, produced by bonding a film Sb to a substrate Sa, in the vacuum has an electrostatic chuck 42 for attracting the bonding substrate S, a gas supply device 7 for supplying gas to the surface of the bonding substrate S attracted to the electrostatic chuck 42, so that a pressure for suppressing expansion of bubbles is applied, and a power supply device 6 applying a voltage, for maintaining attraction of the bonding substrate S by the electrostatic chuck 42 while resisting against the gas pressure, to the electrostatic chuck 42.</p> |
