| 发明名称 |
SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE |
| 摘要 |
A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces absorbance of 0.035 or more for light having a wavelength of 400 nm in a liquid phase obtained when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×105 G. |
| 申请公布号 |
US2015098887(A1) |
申请公布日期 |
2015.04.09 |
| 申请号 |
US201314401246 |
申请日期 |
2013.03.26 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
Iwano Tomohiro;Minami Hisataka;Akutsu Toshiaki;Fujisaki Koji |
| 分类号 |
C09G1/02;B24B37/04;C01B33/113;C09K3/14 |
主分类号 |
C09G1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A slurry comprising:
an abrasive grain; and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces absorbance of 0.035 or more for light having a wavelength of 400 nm in a liquid phase obtained when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×105 G. |
| 地址 |
Tokyo JP |
