| 发明名称 |
COPLANAR INTEGRATION OF A DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE |
| 摘要 |
A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed. |
| 申请公布号 |
US2015097210(A1) |
申请公布日期 |
2015.04.09 |
| 申请号 |
US201414509971 |
申请日期 |
2014.10.08 |
| 申请人 |
Skorpios Technologies, Inc. |
发明人 |
Krasulick Stephen B.;Dallesasse John;Mizrahi Amit;Creazzo Timothy;Marchena Elton;Spann John Y. |
| 分类号 |
H01L31/109;H01L31/0203;H01L31/0304 |
主分类号 |
H01L31/109 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating a composite device used for photonics, the method comprising:
providing a platform, the platform comprising:
a base layer;a device layer above the base layer of the platform, wherein the device layer comprises a plurality of walls forming an opening in the device layer such that a portion of the base layer of the platform is exposed through the device layer; providing a chip, the chip comprising:
a substrate; andan active region; bonding the chip to the portion of the base layer of the platform. |
| 地址 |
Albuquerque NM US |
