| 发明名称 | Integrated circuit package with molded cavity | ||
| 摘要 | An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer. | ||
| 申请公布号 | US8999754(B2) | 申请公布日期 | 2015.04.07 |
| 申请号 | US201213463148 | 申请日期 | 2012.05.03 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Chow Seng Guan;Shim Il Kwon;Han Byung Joon |
| 分类号 | H01L21/00;H01L23/02;H01L23/31;H01L25/16;H01L23/50;H01L23/00 | 主分类号 | H01L21/00 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A method of manufacture of an integrated circuit package system comprising: providing a base substrate; attaching a base die over the base substrate; attaching an integrated interposer having interposer circuit devices, over the base die; electrically connecting base package connectors between the base die and the integrated interposer; and forming a package system encapsulant having an encapsulant cavity over the integrated interposer. | ||
| 地址 | Singapore SG | ||