| 摘要 |
The present invention relates to an electrolyte solution comprising at least one solvent as component A, at least one electrolyte as component B and from 0.1 to 20% by weight, based on the total electrolyte solution, of at least one heteroaromatic compound of the general formula (I) as component C, the use of such a compound in electrolyte solutions, the use of such an electrolyte solution in an electrochemical cell or for metal plating, and also electrochemical cells comprising a corresponding electrolyte solution. |
| 主权项 |
1. A process for metal plating, comprising plating metal using an electrolyte solution comprising at least one solvent selected from the group consisting of a carbonate, heterocyclic compound, ester, ether, aromatic compound and a mixture thereof, as component A, at least one electrolyte as component B and from 0.1 to 20% by weight, based on the total electrolyte solution, of at least one compound of the formula (I),wherein
X1 is N, X2 is CH, X3 is NR1, O or S, m is an integer from 0 to 4, R1 is selected from the group consisting of hydrogen, linear or branched, substituted or unsubstituted C1-C12-alkyl which may be interrupted by at least one heteroatom, substituted or unsubstituted C3-C12-cycloalkyl which may be interrupted by at least one heteroatom, substituted or unsubstituted C5-C20-aryl, and substituted or unsubstituted C5-C20-heteroaryl, and the radicals R2 are selected independently from the group consisting of linear or branched, substituted or unsubstituted C1-C12-alkyl which may be interrupted by at least one heteroatom, substituted or unsubstituted C3-C12-cycloalkyl which may be interrupted by at least one heteroatom, substituted or unsubstituted C5-C20-aryl, substituted or unsubstituted C5-C20-heteroaryl, halides and functional groups having electron-pulling character. |
