| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module which reduces the quantity of heat generated during energization and enables downsizing of a necessary cooler thereby reducing the device physical constitution.SOLUTION: According to one embodiment, a semiconductor module of an electric power conversion system includes: a heat sink 24; mounting substrates 53, 54 having insulation substrates and multiple conductor patterns formed on the insulation substrates, the mounting substrates 53, 54 joined to the heat sink; and a semiconductor element mounted on a part of the conductor pattern. The conductor pattern includes: a mounting pattern 32F on which the semiconductor element is mounted; and a non-mounting pattern 32A on which the semiconductor element is not mounted. The non-mounting pattern is formed thicker than the mounting pattern. |
