| 发明名称 |
RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE WITH PLATED LAYER |
| 摘要 |
Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive comprises a metal oxide, a component of the largest blending amount among the metal components is tin, a component of the second largest blending amount is antimony, and in addition lead and/or copper are contained. |
| 申请公布号 |
US2015072149(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201314241493 |
申请日期 |
2013.09.12 |
| 申请人 |
MITSUBISHI ENGINEERING-PLASTICS CORPORATION |
发明人 |
Motegi Atsushi;Maruyama Hiroyoshi |
| 分类号 |
C08K13/04;C23C18/20;H01Q1/38;C08L69/00;C08K13/02;C23C18/16;C23C18/38;C08K3/00 |
主分类号 |
C08K13/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition for laser direct structuring, comprising, relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive,
wherein the laser direct structuring additive comprises a metal oxide, a component of the largest blending amount among the metal components is tin, a component of the second largest blending amount is antimony, and in addition lead and/or copper are contained. |
| 地址 |
Tokyo JP |
