| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS INCLUDING THE PACKAGE |
| 摘要 |
A light emitting device package includes a package body, and a light emitting device chip provided on a chip mount area of the package body. A molding member is provided on the package body. The package body includes a central area having the chip mount area and a chip non-mount area adjacent to the chip mount area. An upper surface of the light emitting device chip is higher than an upper surface of the package body in the chip non-mount area and an upper surface of the package body in the peripheral area. |
| 申请公布号 |
US2015070909(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414482466 |
申请日期 |
2014.09.10 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
JUNG Kyeoung An;OH Jung Hun |
| 分类号 |
H01L33/48;F21V29/00;F21V3/04;F21V3/00 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package, comprising:
a package body having a central area and a peripheral area adjacent to the central area, the central area including a chip mount area and a chip non-mount area adjacent to the chip mount area; a light emitting device chip provided on the chip mount area of the package body; and a molding member provided on the central area of the package body, wherein an upper surface of the light emitting device chip is higher than an upper surface of the package body in the chip non-mount area and an upper surface of the package body in the peripheral area. |
| 地址 |
Seoul KR |
