发明名称 |
LASER JOINING DEVICE |
摘要 |
The present invention relates to methods for joining materials as well as articles manufactured using such processes. The invention pertains to a process for joining a first substrate to a second substrate. The process includes irradiating a portion of a first substrate with a laser beam having a first wavelength and intensity sufficient to increase the absorbance of the first substrate to light having a second, different wavelength. The laser beam may carbonize at least a portion of the irradiated portion of the first substrate imparting a higher absorbance to light than non-irradiated portions of the first substrate. A second substrate is then placed in contact with the irradiated portion of the first substrate. The first substrate is then irradiated with a second laser having a second wavelength, different to the first wavelength; with a sufficient intensity to heat and, preferably melt, the irradiated portion of the first substrate. |
申请公布号 |
EP2844419(A1) |
申请公布日期 |
2015.03.11 |
申请号 |
EP20130780717 |
申请日期 |
2013.04.25 |
申请人 |
ALERE SAN DIEGO, INC. |
发明人 |
OLSSON, ERIK, MIKAEL;RIVERON, JONATHAN;TOVAR, ARMANDO, RAUL |
分类号 |
B29C65/08;B29C59/16;B29C65/16;B29C65/72;B29C65/78;B81C3/00 |
主分类号 |
B29C65/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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