| 发明名称 |
HYBRID CIRCUIT ASSEMBLY |
| 摘要 |
A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive. |
| 申请公布号 |
US2015062855(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314016806 |
申请日期 |
2013.09.03 |
| 申请人 |
RAYTHEON COMPANY |
发明人 |
Morico Peter D.;Walker John D. |
| 分类号 |
H05K1/14;H05K3/32;H05K3/36 |
主分类号 |
H05K1/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A hybrid circuit assembly, comprising:
an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon, the IMS including a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive; and a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon, the multi-layer PWB connected to the IMS and having an upper surface that is co-planar with an upper surface of the IMS, the PWB mounted on the metal base plate via the insulating adhesive. |
| 地址 |
Waltham MA US |
