发明名称 High-voltage integrated metal capacitor and fabrication method
摘要 A high-voltage metal capacitor with easy integration into existing semiconductor manufacturing processes can provide isolation capacitors up to several kilovolts. The capacitor includes a support layer with internal structure, including a lower place, a bond pad on the support layer, an upper plate disposed on the support layer, the upper plate being arranged above the lower plate, a dielectric layer, at least part of which is between the lower and upper plates, and a passivation layer, at least part of which covers at least part of the upper plate and part of the dielectric layer. A first opening extends from the surface through the passivation and dielectric layers to the lower plate, and a second opening extends from the surface through the passivation layer to the upper plate. A method of manufacturing the capacitor.
申请公布号 US8957500(B2) 申请公布日期 2015.02.17
申请号 US201213648882 申请日期 2012.10.10
申请人 NXP B.V. 发明人 Dubois Jerôme Guillaume Anna;Wessels Piet
分类号 H01L27/02 主分类号 H01L27/02
代理机构 代理人
主权项 1. An integrated circuit capacitor, comprising: a support layer having an internal integrated circuit structure, including a lower plate; a bond pad disposed directly on the support layer such that the bond pad and the support layer are contiguous; an upper plate disposed on the support layer, the upper plate being arranged above the lower plate; a dielectric layer, at least a portion of which is arranged between the lower plate and the upper plate; a passivation layer, at least a portion of which covers at least a portion of the upper plate and at least a portion of the dielectric layer, the passivation layer having a surface; a first opening extending from the surface through the passivation layer and the dielectric layer to the bond pad; a second opening extending from the surface through the passivation layer to the upper plate; and wherein the dielectric layer and the passivation layer are distinct layers.
地址 Eindhoven NL
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