| 摘要 |
A device platform system for the wafer (W) processing technology, and a wafer (W) transmission method thereof. The device platform system comprises: a work platform (202), each side surface of which is used for hanging a processing chamber (203); a top-of-rack wafer loading device (201) which is fixed to an upper surface of the work platform (202) and comprises a wafer box loading unit (205); a wafer loading unit(209) which is arranged relative to the wafer box loading unit (205), and is provided with an internal cavity; a central manipulator (206) which is arranged between the wafer box loading unit (205) and the wafer loading unit(209); a loading gate (208) which is used for closing or opening the internal cavity; a wafer bracket (211) which is located in the internal cavity; and a cut-off gate (210) which is located at the bottom of the internal cavity and is used for opening or closing the work platform (202) internally, wherein an opening (214)is provided at the top of the work platform (202), which is located below the internal cavity and is opposite to the cut-off gate (210), and the cut-off gate (210) can close the opening (214). The device platform system reduces the floor area, and improves the space utilization rate and the transmission efficiency of the wafer (W). |
