发明名称 光重合性且つ光開裂性の樹脂及び低応力複合組成物
摘要 <p>This invention relates to photopolymerizable & photocleavable resin monomers and resin composite compositions, which feature by its unique balanced overall performance including very low polymerization shrinkage and very low shrinkage stress as well. The photoreactive moiety incorporated into such new resin's main frame enable to make the resin and/or the cured resin networks that are based upon such resin photocleavable. Thus the polymerization rate of free radical reaction for (meth)acrylate-based resin systems should be substantially reduced since it alter the network formation process and consequently allow the shrinkage stress getting relief significantly. In addition, it is expected that radically polymerizable resin systems containing such P&P resin would find wide range application in microelectronic, special coating and restorative dentistry where the dimensional stability and contraction stress within cured materials are critical to the total performance.</p>
申请公布号 JP5665316(B2) 申请公布日期 2015.02.04
申请号 JP20090515527 申请日期 2007.06.14
申请人 发明人
分类号 A61K6/00;C08F2/48 主分类号 A61K6/00
代理机构 代理人
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