发明名称 半導体装置、及び半導体装置の製造方法
摘要 <p>Provided is a semiconductor device showing stable high-frequency characteristics. A semiconductor device includes the following configuration. A diffusion region into which acceptors are introduced is formed in a silicon substrate. In addition, a non-diffusion region into which the acceptors are not introduced is disposed in the silicon substrate alternately with the diffusion region. In addition, a first insulating layer is provided so as to contact with the silicon substrate. Further, an interconnect is provided on the first insulating layer.</p>
申请公布号 JP5665970(B2) 申请公布日期 2015.02.04
申请号 JP20130507097 申请日期 2012.02.21
申请人 发明人
分类号 H01L21/3205;H01L21/336;H01L21/768;H01L21/822;H01L23/522;H01L27/04;H01L29/786 主分类号 H01L21/3205
代理机构 代理人
主权项
地址