| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device in which electrical connection among semiconductor circuit elements which are three-dimensionally integrated can be achieved not by wired connection but by a simple composition.SOLUTION: A semiconductor integrated circuit device 100 comprises: a first semiconductor integrated circuit element 1 which includes a pair of strip-shaped differential transmission lines 12A, 12B which are arranged in the same plane and in parallel with each other, and each has a predetermined length, and includes a differential signal transmission element 11 for outputting differential signals to the first differential transmission lines 12A, 12B; and a second semiconductor integrated circuit element 2 which includes a pair of second differential transmission lines 22A, 22B arranged opposite to the first differential transmission lines 12A, 12B in an overlapping manner and a differential signal reception element 21 connected to one ends of the second differential transmission lines 22A, 22B. The second semiconductor integrated circuit element 2 is stacked on the first semiconductor integrated circuit element 1 via a dielectric substance 4. When signals flow in the first differential transmission lines 12A, 12B, the signals are transmitted to the second differential transmission lines 22A, 22B primarily by capacitive coupling.</p> |
