REMOVER COMPOSITION FOR DRY FILM RESIST AND METHOD FOR REMOVING DRY FILM RESIST USING THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a remover composition for a dry film, with which a dry film resist can be completely removed, a metal layer is prevented from corrosion and the remover is reusable, and to provide a method for removing a dry film resist by using the above composition.SOLUTION: The remover composition for a dry film resist comprises a hydroxide-based compound, a chain amine compound, a triazole compound and pure water. The method for removing a dry film resist includes steps of: laminating a dry film 20 on a substrate 100 where a predetermined circuit pattern 10 is formed; partially exposing the laminated dry film 20; forming an opening by developing and removing an unexposed part 21 of the dry film; disposing a solder ball 30 on the circuit pattern 10 where the opening is formed; and bringing the above remover composition for a dry film resist into contact with an exposed part 22 of the dry film.