| 摘要 |
A device (10) for attaching a chip-on film (16) to a lead (15) comprises a platform (11) for conveying the lead (15), a pressure head (12) for carrying the chip-on film (16), and a lead support mechanism (13) matching the pressure head (12) for use, and further comprises a distance adjusting mechanism for measuring a distance between the lead (15) and the support mechanism (13) and reducing the distance after the lead (15) is conveyed to a position between the pressure head (12) and the support mechanism (13). The device (10) can avoid an attachment deviation of the chip-on film, and improve the quality of the product. Further disclosed is a using method of the device (10). |
