| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component capable of preventing chipping or cracks from occurring in a laminated body.SOLUTION: An electronic component 10 includes: a rectangular parallelepiped shaped laminated body 12 in which a plurality of insulator layers 16 are formed and which has a top surface S1 located in a first direction orthogonal to a lamination direction and a base surface S2; and external electrodes 14a and 14b which are configured by a Ni-plating film 50 and a Sn-plating film 52 provided on the Ni-plating film 50 and which are not provided on the top surface S1 but are provided on the base surface S2. A sum of a thickness T1 of the Ni-plating film 50 and a thickness T2 of the Sn-plating film 52 is no less than 11.6 μm, and the thickness Ti of the Ni-plating film 50 is 1.37 times or greater the thickness T2 of the Sn-plating film 52. |
